Teledyne Dalsa has released the Linea HS 16k Backside Illuminated (BSI) TDI camera for near-ultraviolet and visible imaging applications.
With its CLHS interface, the new camera offers enhanced sensitivity, making it suitable for tasks such as the inspection of wafers, flat panel displays, and electronic packaging, as well as photoluminescence and life science imaging. The Linea HS 16k BSI uses Teledyne’s charge-domain CMOS TDI 16k sensor with a 5x5μm pixel size and delivers a maximum line rate of 400kHz aggregate.
Compared with front side illumination, the BSI model significantly improves quantum efficiency in the near ultraviolet and visible wavelengths, the firm says, and boosts signal-to-noise ratio for imaging applications in light-starved conditions.
The Linea HS product family features multi-array charge-domain CMOS TDI technology, offering capabilities including mono/HDR, colour, multifield, and super-resolution imaging for demanding machine vision applications. Linea HS 16k BSI also has the same form factor as the Linea HS FSI, so existing systems can be upgraded.
The Linea HS 16k BSI camera uses a CLHS data interface that delivers 6.5GPix/sec data throughput in a single cable. It also features an active optical cable which the firm says eliminates the need for a repeater, improving data reliability and reducing system costs.
