The project for Efficient Silicon Multi-Chip System-in-Package Integration (ESiP) has been honoured with the 2013 Eniac Innovation Award. ESiP is Europe’s largest research project for maximum integration and miniaturisation of microelectronics systems and uses a thermographic system, developed by InfraTec, for non-destructive detection of faults in SiP components.
For this project, InfraTec developed a new high-definition thermographic camera module that uses the latest detector with a geometrical resolution of 1,280 x 1,024 IR pixels and a thermal resolution of up to 0.02K. Together with the newly developed microscope objective, the system can achieve a geometrical resolution of approximately 2μm.
With these core components, a lock-in thermographic system has been established that supports different thermal stimulation types. Together with project partners, the established thermographic system has been successfully tested for different scenarios.
The research focused on the improvement of reliability, failure analysis and tests for highly integrated microelectronics systems. Forty microelectronics companies and research institutions from a total of nine European countries are working together on the ESiP project with the aim of making system-in-package solution more reliable and testable – InfraTec is one of them.
The Eniac Joint Undertaking (JU) is a public-private partnership focusing on nanoelectronics that brings together Eniac Member/Associated States, the European Commission, and AENEAS (an association representing European R&D actors in this field).
