Gpixel has announced a time-of-flight sensor for 3D imaging. The GTOF0503 sensor features a 5µm three-tap iToF pixel, incorporating an array with a resolution of 640 x 480 pixels.
The sensor was fabricated using Tower Semiconductor's 65nm pixel-level stacked backside illuminated CMOS sensor technology, made in Tower's Uozo, Japan facility.
The companies state that the GTOF0503 sensor offers 'exceptional depth sensing even in challenging ambient light conditions by using the pulse modulation iToF technique'. A demodulation contrast of 80 per cent is achieved with modulation frequencies of up to 165MHz at either 60fps in single modulation frequency, or 30fps in dual modulation frequency depth mode.
Features of the sensor include: integrated light source control, 2 x 2 and 4 x 4 digital binning, H/V image flipping, multiple ROI readout to boost the frame rate, several supported acquisition modes, depth measurement with both single and dual frequency, low-power standby modes, and a MIPI CSI-2 interface.
Gpixel is targeting markets such as vision-guided robots, bin picking, automated guided vehicles, automotive, and factory automation.
Wim Wuyts, Gpixel's chief commercial officer, said: 'Tower’s vast expertise in development of iToF image sensor technology provided an outstanding platform for the design of this cutting-edge performing product. This collaboration produced a unique sensor product that is perfectly suited to serve a wide variety of fast-growing applications and sets a roadmap for future successful developments.'
GTOF0503 is both available as bare die and in a 9 x 9mm ceramic package.
