For the first time ever an uncooled InGaAs-sensor with 640x512-resolution is available at ANDANTA, which can be operated at room-temperature.
The sensor comes with a reduced pixel pitch of 15 µm (formerly 25 µm) reducing the overall active sensor area to just 9.6 x 7.68 mm, identical to the low resolution, uncooled sensor FPA320x256-C. That will ease sensor-integration for all existing users of FPA320x256-C.
Using an InGaAs-planar technology with 53% Indium-content, a spectral response of 0.9 µm to 1.7 µm with a quantum efficiency > 70% is achieved. The use of 8 outputs with 18 MHz pixel rate provides a read out rate of ≥ 300 fps at full image and ≥ 30.000 fps with the smallest sub-window of 32 x 4 pixels.
The new FPA640x512_P15-C sensor uses a simple, hermetic 64-pin ceramics LCC package with dimensions of only 18 mm x 18 mm x 2 mm and a sensor weight of just 1.7 g allowing a very compact and SWaP (Small Weight and Power) camera design. The power consumption is max. 200 mW as there is no cooler to drive.
The same InGaAs matrix sensor chip is now also available in a Kovar package with a 1-stage thermoelectric cooler. The new cooled FPA640x512_P15-TE1 sensor utilizes a high-quality 28-pin, hermetic metal Shrink Dual Inline Package (SDIP) with a pin pitch of 1.78 mm, a size of only 36.1 mm x 25.4 mm x 7.3 mm (without pins) and a sensor weight of only 17 g, which also allows a compact and lightweight camera design, with low power consumption of max. 200 mW (without cooler).
Upon request ANDANTA can recommend a suitable socket to hold the sensors.
