Teledyne Dalsa has launched the Genie Nano-CXP series, a CoaXPress line of CMOS area scan cameras that feature the latest On Semiconductor and e2v sensors.
These image CMOS sensors range from 16 to 67 megapixel resolution with CoaXPress 6.25Gb/s technology offering speed, build quality for wide operating temperature.
The camera has been designed to work with the half-length Xtium-CXP frame grabber, minimising CPU use and improving processing times for host applications by enabling maximum sustained throughput and ready-to-use image data.
Offering 25 million pixels at 80fps in a small form factor, these Genie Nano-CXP cameras are engineered to deliver high-speed, dependable results for applications such as semiconductor wafer inspection, electronics manufacturing, solar panel inspection, and machine vision.
