Sony Europe's Image Sensing Solutions (ISS) division has released the Micro XCD C-mount camera, which will be showcased at the Vision show in Stuttgart.
At 19 x 29 x 29mm the Micro XCD camera has a footprint smaller than a £2 coin. The module weighs just 37g and is 2/3 the cubic size of previous modules from Sony.
The Micro XCD is available in VGA (60fps) and SXGA (45fps) modules. Data transfer is via IEEE1394b I/F FireWire at 1,600Mbps, twice the speed of previous XCD modules from Sony.
The device integrates a high quality 1/3-type CMOS image sensor with the latest FPGA technology, delivering high performance at low power consumption levels.
Sony has taken an innovative approach to design: the number of PCB's required has been reduced from five to three and thinner front and rear panels have been incorporated. The result is robust camera with a smaller footprint, making it suited to a wide range of industrial vision applications.
The XCD-MV6 (VGA) will be available for mass production during November 2010.
