Nanotronics Imaging has introduced new capabilities to its nSPEC product to provide a more complete semiconductor inspection system. nSPEC now detects and categorises defects on semiconductor wafers after photolithographic patterning and other chip processing steps. nSPEC has already been proven highly effective for inspection of blank wafers (substrates and epitaxial) across a full range of compound semiconductor materials: SiC, GaN, GaAs, InP, etc. The patterned wafer inspection feature means nSPEC can track wafer quality through the whole chip manufacturing process from bare substrate all the way to fully processed devices.
Software has been developed in collaboration with Microsemi of Aliso Viejo, CA and supported by funding from the US Air Force.
