Viscom has released its S3088-III AOI system, the newest version of the S3088 system family. This AOI system is optimised for fast, highly accurate solder joint inspection with high inspection depth. With this release, dimensions for the area of inspection were significantly enlarged and the camera technology further improved. The system is delivered with the latest software release, containing helpful new functions for inspection operation.
The AOI system is focused on economical electronic assembly inspection, from prototype to large series. In addition to its highly accurate and fast solder joint inspection, the S3088-III can also be deployed for paste print or placement inspection. Thanks to the further improved positional accuracy, even small defects on components are detected in high resolution mode with precise reliability.
The revised PCB transport now allows larger boards to be inspected, up to 508 x 508mm. The system can also be optimally equipped for extreme cycle time requirements or heavier PCBs.
The scope of the colour evaluation was also widened and colour evaluation for angled inspections is also provided. This improves visualisation of the inspection results, both on the system as well as at the repair station. Extended lifted lead detection, a new innovative function, reduces false alarms caused by poorly stamped edges. This provides high defect coverage, with minimal false alarm rate.
The S3088-III also comes equipped with Viscom software modules, such as switchable resolution with the OnDemandHR function or Integrated Verification for automatic inspection program optimisation.
The AOI system can be used as an inspection island or deployed in the production process. This makes it easy for small electronics service providers as well as large EMS companies to establish and document IPC-compliant electronic assembly production.
