Viscom has introduced its 3D paste inspection system S3088VPI. The 3D technology for paste quality control provides precise measurement technology and offers reliable paste print inspection.
In addition to the customary 2D assessment of misalignment, completeness and smearing, the precise 3D measurement technology records and inspects solder paste height, surface area and volume, and ascertains topography. The 3D technology offers reliable defect detection independent of component and component group orientation. This is extremely advantageous, especially for multipanels with various rotational positions.
The high precision inspection also facilitates combined use of the VPI results with the post-reflow AOI. Process indicators recorded during paste inspection can be evaluated at the AOI to determine whether they result in actual solder defects.
The S3088VPI is based on the efficient and robust S3088 system platform. This inspection system is characterised by simple, convenient programming, so new products can be set up quickly. The 3D option integrates seamlessly into the existing scope of Viscom AOI and is fully compatible with the well-known Viscom add-on modules such as repair and classification station, offline programming and SPC evaluation.
The AOI system can be deployed in the production process efficiently. This makes it easy for small electronics services providers as well as large series manufacturers to establish and document IPC-compliant electronic assembly production.
