Teledyne Imaging, a division of Teledyne Technologies [NYSE: TDY] and global leader in vision solutions, is pleased to announce the successful conclusion of its multi-session virtual event held recently to introduce its newest and most innovative imaging solutions for machine vision. Online sessions led by subject matter experts from across the Teledyne Imaging group covered topics such as AI and embedded vision, extreme high-resolution and high-speed imaging, 3D sensing, non-visible and multi-spectral imaging, and high-volume, low-cost CMOS sensors.
With more than 2200 registrations over three days and six sessions, the event included attendees from North America, Europe, and Asia Pacific. “We couldn’t be more pleased to offer these sessions, proving that even with the temporary closing of trade shows, individuals are keen to spend time online learning about the newest technology,” commented Dale Deering, Director of Market Development, Teledyne Imaging. “With such resounding success, we are planning on offering this showcase again in 2021.”
Recordings of all sessions are available now:
- Clarity at High Speed – Performance Imaging
- Connection is everything – Camera/Data Interfaces
- AI & Embedded Vision – Driving System Innovation
- New Advances in 3D Sensing
- Beyond Sight! Non-Visible and Multi-Spectral Imaging
- Evolving CMOS Sensor Technology
Visit our website at teledyneimaging.com/ntsvision2020 for links to watch all six advanced technology sessions and get a look at the new imaging technology you’ll need to build your next generation vision system.
