Matrix Technologies has unveiled its X3L system. The X3L configuration is available with a dual detector concept, combining a line scan for transmission inspection of complete PCBs in a few seconds and a high-resolution digital flatpanel detector for selective 3D image capturing.
3D X-Ray technology is especially useful for double-sided solder joint inspection of PCB assemblies. With the new X3L system, Matrix Technologies now offers a combination of optimised test concepts – transmission, off-axis image capturing, and 3D-SART – that selectively use the 3D technique where it is really needed. The inspection system uses a high-speed readout TDI camera (line scanner) in parallel, reducing image capture for 18 x 16-inch PCBs to less than 10 seconds.
Each X3 system is equipped with the newly developed 3D-SART (Simultaneous Algebraic Reconstruction Technique), which provides slice images for high quality solder joint analysis. 3D-SART generates detailed, high-resolution images for a reliable analysis based on a minimum amount of projections.
The X3 series uses the well-established MIPS platform with links to all MIPS software modules for programming, classifying and verification. MIPS verify now supports the defect image verification with an extended 3D functionality. The respective images of defects can be displayed in different acquisition modes allowing the comparison of transmission, angle shot, and 3D slice images. With a combined AXI/AOI configuration, a common verification dialogue supplies both X-ray and optical images for efficient processing.
