3D Photonics honoured at CES 2025 Innovation Awards Swave Photonics, Zeiss, PxE Holographic Imaging and Senergetics are amongst those honoured with CES 2025 Innovation Awards, for groundbreaking innovations in their respective fields. Latest Content Photonics honoured at CES 2025 Innovation Awards Live webinar 3 December: The Future of Industrial Imaging - Leveraging AI and 3D Imaging for Predictive Maintenance and Process Control Student finds lost Maya city by accident, using lidar New technologies Robust and high precision ToF camera for cost-efficient 3D imaging in real time White papers C6 Series: The next generation of 3D sensors The new C6 series of 3D sensors from AT - Automation Technology is based on a new sensor platform that supports the latest technology trends such as GenICam 3D. Photometric stereo technique - 3D machine vision’s next frontier Photometric stereo uses 3D surface orientation and its effect on reflected light to produce a contrast image accentuating local 3D surface variations, making complex inspections cheaper and more effective Machine vision – a driver of digital agriculture This white paper explores how machine vision automates and optimises processes in agriculture. From industrial-scale agricultural enterprises to small farms, everyone is relying more on digital technologies in line with smart farming. Webcasts Live webinar 3 December: The Future of Industrial Imaging - Leveraging AI and 3D Imaging for Predictive Maintenance and Process Control More content Lens-free facial recognition system performs as well as current smartphone tech ABB buys AI/3D imaging start-up for robot navigation tech How do cameras that monitor drivers help keep the roads safe? Orbbec releases Persee N1 camera-computer kit for 3D vision enthusiasts Order introduced to 3D imaging technology with new AI approach Photometric stereo technique used for battery inspection Photoneo's new scanning method improves imaging of transparent objects Kitov.ai's machine vision line now compatible with other Robot brands The latest issue of Imaging & Machine Vision Europe is out now! 3D vision helps address semiconductor inspection challenges 3D vision and AI unlock new applications on packaging lines Case study: AT MetrologyPackage - 3D data evaluation in less than 10 minutes Pagination Previous page ‹ Previous Page 3 Next page Next ›
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